국내 최대 기계 및 로봇 연구정보

기술보고서

기술보고서 게시판 내용
타이틀	Alumina Based 500 C Electronic Packaging Systems and Future Development
저자	Chen, Liang-Yu
Keyword	AEROSPACE ENVIRONMENTS;; ALUMINUM OXIDES;; CHIPS (ELECTRONICS); ELECTRONIC PACKAGING;; HIGH TEMPERATURE ENVIRONMENTS;; NASA SPACE PROGRAMS;; OXIDE FILMS;; PRINTED CIRCUITS;; SPACE SHUTTLE MISSIONS;; SYSTEMS ENGINEERING;; THICK FILMS
URL	http://hdl.handle.net/2060/20120016721
보고서번호	ARC-E-DAA-TN6080
발행년도	2012
출처	NTRS (NASA Technical Report Server)
ABSTRACT	NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.