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타이틀	Adhesive-Bonded Composite Joint Analysis with Delaminated Surface Ply Using Strain-Energy Release Rate
저자	Chadegani, Alireza;; Yang, Chihdar;; Smeltzer, Stanley S. III
Keyword	ADHESIVE BONDING;; AIRCRAFT STRUCTURES;; CRACK CLOSURE;; DELAMINATING;; DIFFERENTIAL EQUATIONS;; FINITE ELEMENT METHOD;; INTERLAMINAR STRESS;; J INTEGRAL;; KINEMATICS;; MATHEMATICAL MODELS;; PLY ORIENTATION;; SPECIMEN GEOMETRY;; STRAIN ENERGY RELEASE RATE;; THICKNESS
URL	http://dx.doi.org/10.2514/1.C031516
보고서번호	NF1676L-12745
발행년도	2012
출처	NTRS (NASA Technical Report Server)
ABSTRACT	This paper presents an analytical model to determine the strain energy release rate due to an interlaminar crack of the surface ply in adhesively bonded composite joints subjected to axial tension. Single-lap shear-joint standard test specimen geometry with thick bondline is followed for model development. The field equations are formulated by using the first-order shear-deformation theory in laminated plates together with kinematics relations and force equilibrium conditions. The stress distributions for the adherends and adhesive are determined after the appropriate boundary and loading conditions are applied and the equations for the field displacements are solved. The system of second-order differential equations is solved to using the symbolic computation tool Maple 9.52 to provide displacements fields. The equivalent forces at the tip of the prescribed interlaminar crack are obtained based on interlaminar stress distributions. The strain energy release rate of the crack is then determined by using the crack closure method. Finite element analyses using the J integral as well as the crack closure method are performed to verify the developed analytical model. It has been shown that the results using the analytical method correlate well with the results from the finite element analyses. An attempt is made to predict the failure loads of the joints based on limited test data from the literature. The effectiveness of the inclusion of bondline thickness is justified when compared with the results obtained from the previous model in which a thin bondline and uniform adhesive stresses through the bondline thickness are assumed.