국내 최대 기계 및 로봇 연구정보

기술보고서

기술보고서 게시판 내용
타이틀	Reliability of Area Array Packages with 1500-2500 I/Os
저자	Ghaffarian, Reza
Keyword	CIRCUIT BOARDS;; CIRCUIT RELIABILITY;; DROP TESTS;; ENVIRONMENTAL TESTS;; PHOTOMICROGRAPHS;; PRINTED CIRCUITS;; QUALITY CONTROL;; SCANNING ELECTRON MICROSCOPY;; SOLDERED JOINTS;; SOLDERING;; THERMAL CYCLING TESTS
URL	http://hdl.handle.net/2060/20110008029
보고서번호	JPL-Publ-10-14
발행년도	2010
출처	NTRS (NASA Technical Report Server)
ABSTRACT	This report first provides a literature survey for designing, manufacturing, and reliability test results for area array packages with 1500 to 2500 inputs/outputs (I/Os). It then presents test matrix on design, yield, and workmanship defects on assembly and environmental testing, including thermal cycle and mechanical drop-test evaluation results for FCBGA1704, FPBGA432, and PBGA676 I/Os packages assembled onto printed circuit/wiring boards (PCBs/PWBs). Finally, it summarizes lessons learned from test results for assembly and environmental testing along with optical, scanning electron microscopy (SEM), and x-ray photomicrographs showing damage progress.