기계·로봇 연구정보센터

경북대학교 정밀가공연구실

실험실 정보안내
지도교수	이영문
전공분류	기타(ETC)
주소	School of Mechanical Eng. Kyungpook National University 1370 Sankyuk-dong, Buk-gu Daegu 702-701, Korea
전화
홈페이지	http://webbuild.knu.ac.kr/~ymlee/indexBuilder.html

실험실소개

This laboratory makes some special study of the cutting mechanics analysis and chip control such as Turning, Milling, Grinding, etc.. and also studying both of Force signal and AE signal with a established theory.

Recently, We have developed a program in connection with cutting, and also performing a study of cutting program to improve the Netural network through a signal in connetion with cutting and cutting appearance.

All the researchers of this laboratory are immersing ourselves in this study to make the best on-line system.

연구분야

초정밀 고품질 Worm gear shaft 절삭가공용 Thread whirling machine 개발(2006.06 ~ 2008.05)

고경도 소재를 이용한 LCD 몰드 프레임 금형 기술 개발(2006.09 ~ 2007.08 )

연구성과

이영문
Analysis of Worm Cutting Characteristics in Whirling Process
Materials Science Forum, 2008 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
TOOL STRESS PATTERN DEPENDING ON TOOL GEOMETRY
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2010 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
CUTTING FORCES ANALYSIS IN WHIRLING PROCESS
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2010 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
Cutting force signal pattern recognition using hybrid neural network in end milling
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2009 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
Structural stability estimation of whirling unit
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2009 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
Wiper 공구에 의한 선삭가공시 표면거칠기 특성
한국기계가공학회지, 2008 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
Estimation of the Maximum Undeformed Chip Thickness in Grinding Based on Volume Balance of the Material Removed
JOURNAL OF COMPUTATIONAL AND THEORETICAL NANOSCIENCE, 2008 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
Thermal Analysis of whirling Unit attached to Thread Whirling Machine
Materials Science Forum, 2008 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
평균입자 연삭모델에 의한 최대미변형칩두께의 예측
한국공작기계학회 논문집 , 2007 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

이영문
Effects of the maximum undeformed chip thickness on roughness and specific energy in surface grinding
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2006 , ,Vol. 0No. 0 ,pp. 0 ~ 0(SCIE, 0:0.0

프로젝트

[Al-rich 세라믹 코팅층의 물성 향상 기술 개발] 2005.07 ~ 2006.04

[CBN TOP SOLID 볼 엔드밀 개발] 2005.07 ~ 2006.04

[판재 다열 Bead Roll 성형기 개발] 2005.09 ~ 2006.08

[관재성형기술에 의한 자동차용 Cowl Cross Assy 부품 개발] 2005.09 ~ 2006.08

[초정밀 첨단소재 휴대폰 표준복합시험기 개발] 2005.12 ~ 2006.11