|제목(국문)||IC-패키지에 대한 각종 디지탈 화상처리 기술의 적용방법에 대한 연구|
|제목(영문)||A Study on the Application Method of Various Digital Image Processing in the IC Package|
(Jae Yeol Kim
,조선대학교 공과대학 정밀기계공학과
|초록||This Paper is to aim the microdefect evaluation of IC package into a quantitative from NDI's image processing of ultrasonic wave.
(1) Automatically repeated discrimination analysis method can be devided in the category of all kind of defects on IC package, and also can be possible to have a sampling of partial delamination.
(2) It is possible that the information of edge section in silicon ship surrounding can be extractor by the partial image processing of IC package. Also, the crack detection is possible between the resin part and lead frame.